SMT Stencil Printer Solder Paste Stencil Printing Machine Width Adjustment
Specification
| Model | GSE |
| Stencil size | 370x370mm(min size) |
| 737x737mm(max size) |
| 20-40mm(thickness) |
| Max PCB Size | 400x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| PCB warpage | max 1% PCB diagonal |
| Transport height | 900±40mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, can be adjustment |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/up-down table |
| PCB clamping system | Patented over the top clamping/side clamping |
| Print head | Two independent motorised printheads |
| Squeegee Pressure | 0.5~10Kg (Program Control) |
| Print Speed | 6-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Cleaning System | Ireinforced vacuum absorption ,dry ,wet, vacuum three modes |
| CCD FOV | 8x6mm |
| Machine adjust range | X: ± 3mm, Y:± 7 mm , θ:± 2° |
| Vision | Look Up/Down Optics Structure/CCD/Geometry Pattern-match |
Whole Machine Specification
| Repeat Position Accuracy | ±0.01mm |
| Printing Accuracy | ±0.025mm |
| Cycle Time | ＜8 Sec |
| Product Changeover | old:<3 mins,new:<5 mins |
| Air supply | 4~6 kgf/cm |
| Power supply | AC:220±10%,50/60HZ, 2.5KW |
| Control method | PC |
| Operation system | Windows XP/Win7 |
| Machine Dimensions | 1158(L) x 1362(W) x 1463 (H)mm |
| Machine Weight | Approx: around 1000Kg |
Features
1, GKG special adjustment jacking platform. Stable and easy to adjust, it can quicklyadjust the pin jacking height of PCB with different thickness.
2, Cleaning system: GKG cleaning system equipped with three cleaning methods: dry cleaning, wet cleaning, vacuum. which can be combined to use. It can also be cleaned by manual if customer do not need to use automatic cleaning to reduce the cleaning time and improve production efficiency. The newly wiping system ensures full contact with the stencil, increased vacuum suction can effectively eliminate the remaining paste
in the mesh, which can achieve effective automatic cleaning function.CCD part and c leaning system is separated, when CCD working, CCD part
independently move to reduce the servo motor load and improve the machine speed and accuracy.
3, Image and optical system. Using uniform ring light and high brightness coaxial light, with promise brightness adjustment function, then all types of Mark points can be well recognized (Including the rugged mark points), applicable for tin plating, coppering, gold plating,tin spraying, FPC and other types PCB with of different colors. With GKG patent mathematical model,able to ensure high accuracy.
4, High adaptability steel mesh frame clamping system. Able to print all kinds of size screen frames, and quickly change modular production line.
5, Using Windows XP/win7 operation interface, with good man-machine dialogue function, and easy for operator quickly familiar with the operation especially when doing navigation effect of programming file. easy to switch Chinese/English interface, with operation log, fault record / fault self-diagnosis / fault analysis prompt / light alarm and other functions.
6, 2D paste printing quality test and analysis, Able to inspect shift ,insufficient paste, missing and bridge and other defects to ensure the printing quality.
About Packaging
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PC Control Solder Paste Machine SMT Stencil Printer Automatic Width Adjustment Automatic Stencil Printer Images
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