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Brand Name : GKG
Model Number : G9+
Certification : CE,TUV,ROHS
Place of Origin : China
MOQ : 1 set
Price : Negotiation
Payment Terms : T/T, Western Union, MoneyGram
Supply Ability : 100 sets per month
Delivery Time : 7-15days
Packaging Details : Wooden Package
Product name : High-end Solder paste printing machine
Other name : Automatic Screen Printing Machine
PCB size : 50x50~450x340mm
Transport height : 900±40mm
Air pressure : 4-6kgf/cm³
PCB thickness : 0.4-6mm
Max board weight : 5kg
Machine weight : 1000kg
Automatic Solder Paste Printer for Industrial 4.0 MES System
Specification
| Model | G9+ |
| Max PCB Size | 450x340mm |
| Min PCB size | 50x50mm |
| PCB thickness | 0.4-6mm |
| Max board weight | 5kg |
| Transport height | 900±40mm |
| Board edge gap | 2.5mm |
| Board height | 15mm |
| Transport direction | L-R,R-L |
| Transport speed | max 1500mm/s, program control |
| Transport method | One stage |
| WIdth adjustment | automatic |
| I/O interface | SMEMA |
| PCB positioning (support method) | Magnetic pin/support block/manual up-down table |
| PCB clamping system | Patented over the top clamping |
| Side clamping | |
| Adsorption function | |
| Print snap-off | 0-20mm |
| Print mode | one/twice |
| Print Speed | 10-200mm/sec |
| Print Mode | One /Twice |
| Squeegee Type | Rubber /steel Squeegee Blade(Angle 45°/55°/60°) |
| Print pressure | 0.5-10kg |
| Template fram size | 470*370mm~737*737mm(20-40thickness) |
| Cleaning System | Droops of rain type cleaning system |
| Reinforced vacuum absorption | |
| Dry, wet vacuum three modes | |
| Back and forth cleaning | |
| CCD FOV | 10x8mm |
| Fiducial mark types | Standard Fiducial mark shape |
| Pad | |
| Hole | |
| Camera system | Look up/down optics structure |
| CCD digital camera | |
| Geometry pattern match |
Features
The CCD digital system boasts an innovative optical path design that provides uniform circular lighting and high-brightness coaxial illumination. The adjustable brightness of both light source systems, in an infinite loop, allows for seamless recognition of diverse mark points, including uneven ones on tin-plated, copper-plated, silver-plated surfaces, hot-air soldering points, FPCs, and PCBs of varying colors.
The system offers high-precision PCB thickness adjustment and a sturdy structure that guarantees stable XY movement. Manual adjustments make accommodating different PCB thicknesses straightforward.
The guide rail positioning system incorporates a detachable new pattern guide rail and a programmable flexible side clamp, tailored for FPCs and warped PCBs. A unique clamping plate device, controlled by software programming, automatically adapts to various PCB thicknesses without any issues.
The innovative squeegee structure design incorporates a comprehensive squeegee system that enhances stability and prolongs the squeegee's lifespan.
The high-speed stencil cleaning system features a downward dispensing cleaning structure that prevents clogged openings, a common issue that can lead to ineffective cleaning. The solvent dispense length can be effortlessly adjusted via software control.
The new multi-function interface is user-friendly, intuitive, and easy to understand. Additionally, it includes real-time monitoring of temperature and humidity.

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High-Speed Automatic Solder Paste Machine for Industrial 4.0 MES System Images |